印刷精度   Machine Alignment Capability	±25μm@6σ, Cpk≥2.0
重复印刷精度   Process Alignment Capability	±10μm@6σ, Cpk≥2.0
循环时间   Cycle Time	15s
最大可印刷面积   Maximum Print Area	100mm x80mm~850mm x 610mm
网框尺寸   Screen Frame Size	737mm x 737mm~1200mm x 900mm
网框厚度   Screen Frame Thickness	20mm -  40mm

最小基板尺寸   Substrate Handling Size (minimum)	100mm (X) x 80mm (Y)
最大基板尺寸   Substrate Handling Size (maximum)	850mm x610mm
基板厚度   Substrate Thickness	0.6mm -  6 mm

刮刀压力   Print Pressure	0.1kg -  10kg
印刷速度   Print Speed	6mm/sec -  120mm/sec
印刷间隙   Print Gap	0mm -  20mm
脱    模   Substrate Separation	脱模速度:0.1 -  20mm/s   Speed:0.1mm/sec -  20mm/sec 脱模距离:0mm -  20mm   Distance:0mm -20mm
脱模方式   Separation option	先起刮刀再脱模，先脱模再起刮刀，保持预压力脱模（面脱模，线脱模） Separation after squeegee up; Squeegee up after separation; Separation by keeping squeegee on the stencil (Area Separation,Line Separation)
适用浆料   Apply paste option	锡膏，油墨，银浆   solder paste，printing ink, silver paste